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About this product

Division: Spine
Category: Interbody Fusion

The T-PAL implant is intended to replace lumbar intervertebral discs and to fuse the adjacent vertebral bodies together at vertebral levels L1–S1. The T-PAL implant is designed for a transforaminal approach.


Intended Use

Indications are lumbar and lubosacral pathologies in which segmental spondylodesis is indicated, for example:

  • Degenerative disc diseases and spinal instabilities
  • Revision procedures for post-discectomy syndrome
  • Pseudarthrosis or failed spondylodesis
  • Degenerative spondylolisthesis
  • Isthmic spondylolisthesis


  • Vertebral body fractures
  • Spinal tumours
  • Major spinal instabilities
  • Primary spinal deformities
  • Osteoporosis

Important: T-PAL must be applied in combination with posterior fixation.



Features & Benefits


Features Benefits
Implant with guiding rails
  • Rails on top of the implant, guide and turn the cage between the vertebral bodies into the desired position
  • Three x-ray markers help to visualize the implant under radiographic control
Pyramidal teeth Provide resistance to implant migration
Self-distracting nose Allows for ease of insertion
Axial window Accommodates autogenous bone graft or bone graft substitute to allow fusion to occur through the cage
Material Available in two materials; PEEK (with Titanium alloy marker pins [TAN]); Titanium alloy (TAN)
Lordotic angle 5° to restore the natural spine lordotic curve (except for the 7 mm height)
One surgery, one instrument
  • One key instrument for insertion of implant and trials
  • Applicator allows a controlled and guided insertion based on the pivoting option
  • Security button to prevent implant disengagement
  • Applicator is designed for minimally invasive surgeries


Please refer to the surgical technique guide or package inserts if included for a complete list of indications, contraindications, precautions and warnings. For further information on DePuy Synthes Products, please contact your local DePuy Synthes Representative .
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